M485L2829MT0-CA0
vs
MT9VDDT12872HIY-202
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Part Package Code
MODULE
Package Description
DIMM, DIMM200,24
DIMM, DIMM200,24
Pin Count
200
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.8 ns
0.8 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
100 MHz
125 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDMA-N200
R-PDMA-N200
Memory Density
9663676416 bit
9663676416 bit
Memory IC Type
DDR DRAM MODULE
DDR DRAM MODULE
Memory Width
72
72
Moisture Sensitivity Level
1
Number of Functions
1
Number of Ports
1
Number of Terminals
200
200
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128MX72
128MX72
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM200,24
DIMM200,24
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Self Refresh
YES
Supply Current-Max
4.5 mA
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.6 mm
0.6 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Compare M485L2829MT0-CA0 with alternatives
Compare MT9VDDT12872HIY-202 with alternatives