M93C66-BN7G vs M93C66-BN7 feature comparison

M93C66-BN7G STMicroelectronics

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M93C66-BN7 STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description ROHS COMPLIANT, PLASTIC, DIP-8 PLASTIC, DIP-8
Pin Count 8 8
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Alternate Memory Width 8 8
Clock Frequency-Max (fCLK) 2 MHz 2 MHz
Data Retention Time-Min 40 40
Endurance 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e0
Length 9.27 mm 9.27 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X16 256X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 5.33 mm
Serial Bus Type MICROWIRE MICROWIRE
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.0015 mA 0.0015 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Write Protection SOFTWARE SOFTWARE
Base Number Matches 1 1

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