MA4L021-120
vs
MA4L022-120
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
M/A-COM TECHNOLOGY SOLUTIONS INC
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
| Package Description |
O-CEMW-N2
|
O-CEMW-N2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
CASE 120
|
CASE 120
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW LEAKAGE
|
LOW LEAKAGE
|
| Application |
LIMITER
|
LIMITER
|
| Breakdown Voltage-Min |
35 V
|
20 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
0.2 pF
|
0.19 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
2.1 Ω
|
2 Ω
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
HIGH FREQUENCY TO KU BAND
|
HIGH FREQUENCY TO KU BAND
|
| JESD-30 Code |
O-CEMW-N2
|
O-CEMW-N2
|
| Minority Carrier Lifetime-Nom |
0.01 µs
|
0.01 µs
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
MICROWAVE
|
MICROWAVE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
END
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Base Number Matches |
2
|
1
|
|
|
|