MAX1209ETL
vs
MAX1208ETL-T
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
6 X 6 MM, 0.8 MM HEIGHT, MO-220WJJD-2, TQFN-40
|
HVQCCN, LCC40,.24SQ,20
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Analog Input Voltage-Max |
1.024 V
|
1.024 V
|
| Analog Input Voltage-Min |
-1.024 V
|
-1.024 V
|
| Conversion Time-Max |
0.0125 µs
|
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
| JESD-30 Code |
S-XQCC-N40
|
S-XQCC-N40
|
| JESD-609 Code |
e0
|
e0
|
| Length |
6 mm
|
6 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
2'S COMPLEMENT BINARY
|
2'S COMPLEMENT BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Sample Rate |
80 MHz
|
80 MHz
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
LCC40,.24SQ,20
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
|
|
|
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