MAX150BEPP+ vs ADC0820CNEN feature comparison

MAX150BEPP+ Maxim Integrated Products

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ADC0820CNEN NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description PLASTIC, DIP-20 DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog Input Voltage-Max 5.1 V 5.1 V
Analog Input Voltage-Min -0.1 V -0.1 V
Conversion Time-Max 2 µs 2.5 µs
Converter Type ADC, FLASH METHOD ADC, FLASH METHOD
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e3
Length 26.16 mm 26.695 mm
Moisture Sensitivity Level 1
Number of Analog In Channels 1 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Bit Code BINARY BINARY
Output Format PARALLEL, 8 BITS PARALLEL, 8 BITS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Sample and Hold / Track and Hold TRACK TRACK
Seated Height-Max 4.572 mm 4.06 mm
Supply Current-Max 15 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Linearity Error-Max (EL) 0.39%

Compare MAX150BEPP+ with alternatives

Compare ADC0820CNEN with alternatives