MAX160CPN
vs
MX7574BQ
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
CERDIP-18
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
6 µs
|
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-PDIP-T18
|
R-GDIP-T18
|
| JESD-609 Code |
e0
|
e0
|
| Length |
22.86 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
18
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Output Bit Code |
BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY
|
BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Seated Height-Max |
4.572 mm
|
5.08 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Linearity Error-Max (EL) |
|
0.2%
|
| Package Equivalence Code |
|
DIP18,.3
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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