MAX4888ETI+
vs
MAX4888AETI+TG3U
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
5.5 X 3.5 MM, 0.80 MM HEIGHT, LEAD FREE, TQFN-28
|
,
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-XQCC-N28
|
|
| JESD-609 Code |
e3
|
|
| Length |
5.5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
2
|
|
| Number of Functions |
4
|
|
| Number of Terminals |
28
|
|
| Off-state Isolation-Nom |
56 dB
|
|
| On-state Resistance Match-Nom |
0.6 Ω
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
VQCCN
|
|
| Package Equivalence Code |
LCC28,.14X.22,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.85 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Switch-off Time-Max |
50 ns
|
|
| Switch-on Time-Max |
250 ns
|
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
3.5 mm
|
|
| Base Number Matches |
6
|
1
|
|
|
|
Compare MAX4888ETI+ with alternatives
Compare MAX4888AETI+TG3U with alternatives