MAX508BEWP+
vs
MAX508BCPP+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
|
| Part Package Code |
20-SOIC_W-300_MIL
|
20-PDIP-300_MIL
|
| Package Description |
0.300 INCH, SOIC-20
|
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
20-SOIC_W-300_MIL
|
20-PDIP-300_MIL
|
| Reach Compliance Code |
compliant
|
|
| Date Of Intro |
2001-04-24
|
2001-04-24
|
| Analog Output Voltage-Max |
10 V
|
10 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDIP-T20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
12.8 mm
|
26.16 mm
|
| Linearity Error-Max (EL) |
0.024%
|
0.024%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP20,.4
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
4.572 mm
|
| Settling Time-Max |
5 µs
|
5 µs
|
| Supply Current-Max |
12 mA
|
12 mA
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
7.5 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX508BEWP+ with alternatives
Compare MAX508BCPP+ with alternatives