MAX552ACUB
vs
MAX552BEUB-T
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
UMAX-10
|
UMAX-10
|
Pin Count |
10
|
10
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Analog Output Voltage-Max |
2.46 V
|
|
Analog Output Voltage-Min |
1.23 V
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
OFFSET BINARY
|
OFFSET BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PDSO-G10
|
S-PDSO-G10
|
JESD-609 Code |
e0
|
e0
|
Length |
3 mm
|
3 mm
|
Linearity Error-Max (EL) |
0.0122%
|
0.0244%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
10
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP10,.19,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Settling Time-Max |
1 µs
|
|
Settling Time-Nom (tstl) |
0.12 µs
|
0.12 µs
|
Supply Current-Max |
0.5 mA
|
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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