MAX5812MEUT#TG16
vs
MCP4725A1T-E/MAY
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOT-23
|
|
| Package Description |
LSSOP,
|
HVSON,
|
| Pin Count |
6
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Analog Output Voltage-Max |
5 V
|
5.5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
R-PDSO-G6
|
S-PDSO-N6
|
| JESD-609 Code |
e3
|
e4
|
| Length |
2.9 mm
|
2 mm
|
| Linearity Error-Max (EL) |
0.3906%
|
0.354%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.45 mm
|
0.9 mm
|
| Settling Time-Nom (tstl) |
4 µs
|
6 µs
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.625 mm
|
2 mm
|
| Base Number Matches |
2
|
1
|
| Package Equivalence Code |
|
TSSOP6,.08
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
0.4 mA
|
|
|
|
Compare MAX5812MEUT#TG16 with alternatives
Compare MCP4725A1T-E/MAY with alternatives