MAX5873EGK-TD
vs
DAC3164IRGCR
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68
|
HVQCCN,
|
Pin Count |
68
|
64
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
1.1 V
|
1 V
|
Analog Output Voltage-Min |
-0.5 V
|
-0.5 V
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
JESD-30 Code |
S-XQCC-N68
|
S-PQCC-N64
|
JESD-609 Code |
e0
|
e4
|
Length |
10 mm
|
9 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC68,.4SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.9 mm
|
1 mm
|
Settling Time-Nom (tstl) |
0.014 µs
|
0.011 µs
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
10 mm
|
9 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Peak Reflow Temperature (Cel) |
|
260
|
Sample Rate |
|
500 MHz
|
Supply Current-Max |
|
59 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX5873EGK-TD with alternatives
Compare DAC3164IRGCR with alternatives