MAX5969BETB+
vs
MAX5969AETB+T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
10-LFCSP-3X3X0.75
|
10-LFCSP-3X3X0.75
|
| Pin Count |
10
|
10
|
| Manufacturer Package Code |
10-LFCSP-3X3X0.75
|
10-LFCSP-3X3X0.75
|
| Date Of Intro |
2010-01-28
|
2010-01-28
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-PDSO-N10
|
S-PDSO-N10
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC10,.12,20
|
SOLCC10,.12,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max (Isup) |
0.55 mA
|
0.55 mA
|
| Supply Voltage-Max (Vsup) |
60 V
|
60 V
|
| Supply Voltage-Nom (Vsup) |
48 V
|
48 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MAX5969BETB+ with alternatives
Compare MAX5969AETB+T with alternatives