MAX9994ETP+T
vs
MAX9982ETP+D
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
20-LFCSP-5X5X0.75
|
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
20-LFCSP-5X5X0.75
|
|
| Date Of Intro |
2004-10-27
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| JESD-30 Code |
S-XQCC-N20
|
S-XQCC-N20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
1
|
1
|
| Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
|
5 X 5 MM, 0.80 MM HEIGHT, MO-220, QFN-20
|
| Reach Compliance Code |
|
compliant
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX9994ETP+T with alternatives
Compare MAX9982ETP+D with alternatives