MB81464-12PD
vs
MB81464-12P
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU LTD
|
FUJITSU LTD
|
| Part Package Code |
LCC
|
DIP
|
| Package Description |
QCCJ, LDCC18,.33X.53
|
DIP-18
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Time-Max |
120 ns
|
120 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PQCC-J18
|
R-PDIP-T18
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
PAGE MODE DRAM
|
PAGE MODE DRAM
|
| Memory Width |
4
|
4
|
| Number of Terminals |
18
|
18
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
64KX4
|
64KX4
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC18,.33X.53
|
DIP18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
256
|
256
|
| Supply Current-Max |
0.065 mA
|
0.065 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
MOS
|
MOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
1
|
4
|
|
|
|
Compare MB81464-12PD with alternatives
Compare MB81464-12P with alternatives