MBM29DL640E80TN vs NAND01GW4B2BV6E feature comparison

MBM29DL640E80TN FUJITSU Semiconductor Limited

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NAND01GW4B2BV6E STMicroelectronics

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC STMICROELECTRONICS
Part Package Code TSOP1 SOIC
Package Description PLASTIC, TSOP1-48 VSSOP,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 80 ns 25000 ns
Alternate Memory Width 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 15.4 mm
Memory Density 67108864 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 2 1
Number of Terminals 48 48
Number of Words 4194304 words 67108864 words
Number of Words Code 4000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 VSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 0.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 12 mm 12 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare NAND01GW4B2BV6E with alternatives