MBM29F016A-70PFTR vs M29W160DT70M1E feature comparison

MBM29F016A-70PFTR FUJITSU Semiconductor Limited

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M29W160DT70M1E STMicroelectronics

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC STMICROELECTRONICS
Part Package Code TSOP1 SOIC
Package Description PLASTIC, REVERSE, TSOP1-48 0.525 INCH, PLASTIC, SO-44
Pin Count 48 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G44
Length 18.4 mm 28.2 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Organization 2MX8 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.8 mm
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 12 mm 13.3 mm
Base Number Matches 1 1
Rohs Code Yes
Additional Feature TOP BOOT BLOCK
Alternate Memory Width 8
Boot Block TOP
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MBM29F016A-70PFTR with alternatives

Compare M29W160DT70M1E with alternatives