MBM29F400BC-70PFTN vs AM29F400BB-75DTK2 feature comparison

MBM29F400BC-70PFTN FUJITSU Semiconductor Limited

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AM29F400BB-75DTK2 Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SPANSION INC
Part Package Code TSOP1 DIE
Package Description PLASTIC, TSOP1-48 SURF TAPE PACKAGE-43
Pin Count 48 43
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PDSO-G48 R-XUUC-N43
Length 18.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 43
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSOP1 DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.5 mm
Terminal Position DUAL UPPER
Type NOR TYPE NOR TYPE
Width 12 mm
Base Number Matches 1 1
Rohs Code Yes
Additional Feature BOTTOM BOOT BLOCK
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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Compare AM29F400BB-75DTK2 with alternatives