MBM29LV160BE-90TN vs MBM29PL160BD90PFTN feature comparison

MBM29LV160BE-90TN FUJITSU Limited

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MBM29PL160BD90PFTN Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SPANSION INC
Part Package Code TSOP1 TSOP1
Package Description PLASTIC, TSOP1-48 TSOP1,
Pin Count 48 48
Reach Compliance Code unknown compliant
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 2 1
Rohs Code No
JESD-609 Code e0
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

Compare MBM29LV160BE-90TN with alternatives

Compare MBM29PL160BD90PFTN with alternatives