MBM29LV160T-80PFTN vs AM29LV160BT80FC feature comparison

MBM29LV160T-80PFTN FUJITSU Semiconductor Limited

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AM29LV160BT80FC Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SPANSION INC
Part Package Code TSOP1 TSOP
Package Description PLASTIC, TSOP1-48 TSOP1-R,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 80 ns 80 ns
Additional Feature CONFIGURABLE AS 1M X 16; 100000 PROGRAM/ERASE CYCLES MIN TOP BOOT BLOCK
Boot Block TOP
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Organization 2MX8 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1-R
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 12 mm 12 mm
Base Number Matches 3 2
Rohs Code No
Alternate Memory Width 8
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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Compare AM29LV160BT80FC with alternatives