MBM29LV200BC-90PFTN vs AM29F200BB-70EIT feature comparison

MBM29LV200BC-90PFTN FUJITSU Semiconductor Limited

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AM29F200BB-70EIT AMD

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP1 TSOP1
Package Description PLASTIC, TSOP1-48 MO-142DD, TSOP-48
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 70 ns
Additional Feature CONFIGURABLE AS 128K X 16; 100000 PROGRAM/ERASE CYCLES MIN BOTTOM BOOT BLOCK
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX8 128KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 12 mm 12 mm
Base Number Matches 1 1
Alternate Memory Width 8

Compare MBM29LV200BC-90PFTN with alternatives

Compare AM29F200BB-70EIT with alternatives