MBM29LV800TA-12PBT-E1 vs MX29L8100TXBI-12 feature comparison

MBM29LV800TA-12PBT-E1 Spansion

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MX29L8100TXBI-12 Macronix International Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC MACRONIX INTERNATIONAL CO LTD
Part Package Code BGA BGA
Package Description PLASTIC, FBGA-48 BGA,
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
Additional Feature CONFIGURABLE AS 512K X 16; 100000 PROGRAM/ERASE CYCLES MIN
Alternate Memory Width 8 8
Boot Block TOP
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 9 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Width 6 mm
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare MBM29LV800TA-12PBT-E1 with alternatives

Compare MX29L8100TXBI-12 with alternatives