MBM29PDS322TE11PBT vs AM29DL322DB90WDI feature comparison

MBM29PDS322TE11PBT Spansion

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AM29DL322DB90WDI Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description TFBGA, BGA63,8X12,32
Pin Count 63
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 115 ns 90 ns
Boot Block TOP BOTTOM
Command User Interface YES YES
Data Polling YES YES
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0
Length 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16
Number of Functions 1
Number of Sectors/Size 8,63 8,63
Number of Terminals 63 63
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA63,8X12,32 BGA63,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Page Size 4 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1.2 mm
Sector Size 4K,32K 8K,64K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.055 mA 0.045 mA
Supply Voltage-Max (Vsup) 2.2 V
Supply Voltage-Min (Vsup) 1.8 V
Supply Voltage-Nom (Vsup) 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES YES
Type NOR TYPE NOR TYPE
Width 7 mm
Base Number Matches 3 3
Alternate Memory Width 8
Common Flash Interface YES
Power Supplies 3/3.3 V

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