MC3303P vs TLV2464CPW feature comparison

MC3303P Freescale Semiconductor

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TLV2464CPW Rochester Electronics LLC

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP14,.3 GREEN, PLASTIC, TSSOP-14
Reach Compliance Code unknown unknown
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.5 µA
Frequency Compensation YES
Input Offset Voltage-Max 10000 µV 2200 µV
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Low-Offset NO
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Power Supplies 5/+-15 V
Qualification Status Not Qualified
Slew Rate-Nom 0.6 V/us 1.6 V/us
Supply Current-Max 7 mA
Supply Voltage Limit-Max 18 V 6 V
Surface Mount NO YES
Technology BIPOLAR CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Voltage Gain-Min 10000
Base Number Matches 6 2
Pbfree Code Yes
Part Package Code TSSOP
Pin Count 14
Average Bias Current-Max (IIB) 0.025 µA
Common-mode Reject Ratio-Nom 80 dB
Length 5 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Supply Voltage-Nom (Vsup) 3 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 5200
Width 4.4 mm

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