MC3303P
vs
TLV2464CPW
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
DIP, DIP14,.3
|
GREEN, PLASTIC, TSSOP-14
|
Reach Compliance Code |
unknown
|
unknown
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Bias Current-Max (IIB) @25C |
0.5 µA
|
|
Frequency Compensation |
YES
|
|
Input Offset Voltage-Max |
10000 µV
|
2200 µV
|
JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
e4
|
Low-Offset |
NO
|
|
Number of Functions |
4
|
4
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSSOP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Power Supplies |
5/+-15 V
|
|
Qualification Status |
Not Qualified
|
|
Slew Rate-Nom |
0.6 V/us
|
1.6 V/us
|
Supply Current-Max |
7 mA
|
|
Supply Voltage Limit-Max |
18 V
|
6 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Gain-Min |
10000
|
|
Base Number Matches |
6
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
14
|
Average Bias Current-Max (IIB) |
|
0.025 µA
|
Common-mode Reject Ratio-Nom |
|
80 dB
|
Length |
|
5 mm
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Nom (Vsup) |
|
3 V
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Unity Gain BW-Nom |
|
5200
|
Width |
|
4.4 mm
|
|
|
|
Compare TLV2464CPW with alternatives