MC33879APEKR2,518 vs 935310502518 feature comparison

MC33879APEKR2,518 NXP Semiconductors

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935310502518 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SOIC-32 ,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits 8
Input Characteristics STANDARD
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PDSO-G32
Length 11 mm
Number of Functions 1
Number of Terminals 32
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Characteristics OPEN-DRAIN
Output Current Flow Direction SINK
Output Peak Current Limit-Nom 1.2 A
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY
Package Code HSSOP
Package Equivalence Code SSOP32,.4
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Seated Height-Max 2.45 mm
Supply Current-Max 0.7 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 3.1 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology MOS
Temperature Grade AUTOMOTIVE
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Turn-off Time 100 µs
Turn-on Time 50 µs
Width 7.5 mm
Base Number Matches 1 1
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 40

Compare MC33879APEKR2,518 with alternatives

Compare 935310502518 with alternatives