MC33879APEKR2,518
vs
MC33879TEK
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
SOIC-32
|
SOIC-32
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
|
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
|
| Driver Number of Bits |
8
|
8
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| Length |
11 mm
|
11 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Output Peak Current Limit-Nom |
1.2 A
|
1.2 A
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSSOP
|
HSSOP
|
| Package Equivalence Code |
SSOP32,.4
|
SSOP32,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Seated Height-Max |
2.45 mm
|
2.65 mm
|
| Supply Current-Max |
0.7 mA
|
0.7 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3.1 V
|
3.1 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
MOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Turn-off Time |
100 µs
|
100 µs
|
| Turn-on Time |
50 µs
|
50 µs
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
32
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MC33879APEKR2,518 with alternatives