MC34708VMR2
vs
MC34708VMR2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
LFBGA,
|
13 X 13 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MO-275HHAC-1, BGA-206
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
S-PBGA-B206
|
S-PBGA-B206
|
| JESD-609 Code |
e1
|
e1
|
| Length |
13 mm
|
13 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
206
|
206
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.61 mm
|
1.61 mm
|
| Supply Voltage-Max (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
13 mm
|
13 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
206
|
| Package Equivalence Code |
|
BGA206,15X15,32
|
| Qualification Status |
|
Not Qualified
|
|
|
|