MC68HC11E0CFN3R2 vs MC68HC11E9BCFN2 feature comparison

MC68HC11E0CFN3R2 Motorola Mobility LLC

Buy Now Datasheet

MC68HC11E9BCFN2 Freescale Semiconductor

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code LCC LCC
Package Description QCCJ, QCCJ, LDCC52,.8SQ
Pin Count 52 52
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 16 16
Bit Size 8 8
Clock Frequency-Max 12 MHz 8 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J52 S-PQCC-J52
Length 19.125 mm 19.1262 mm
Number of I/O Lines 38 38
Number of Terminals 52 52
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
ROM Programmability MROM MROM
Seated Height-Max 4.57 mm 4.57 mm
Speed 3 MHz 2 MHz
Supply Current-Max 35 mA 27 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS HCMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 19.125 mm 19.1262 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 6
Rohs Code No
ECCN Code EAR99
CPU Family 6800
JESD-609 Code e0
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code LDCC52,.8SQ
Peak Reflow Temperature (Cel) 220
RAM (bytes) 512
ROM (words) 12288
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

Compare MC68HC11E0CFN3R2 with alternatives

Compare MC68HC11E9BCFN2 with alternatives