MC68HC705P6CP vs MC68HC705P6VS feature comparison

MC68HC705P6CP Freescale Semiconductor

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MC68HC705P6VS Motorola Mobility LLC

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO OPERATES AT 3.3V SUPPLY @ 1MHZ OPERATES AT 3V MIN SUPPLY @ 1MHZ
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 4.2 MHz 4.2 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T28 R-CDIP-T28
Length 36.83 mm 37.145 mm
Number of I/O Lines 21 21
Number of Terminals 28 28
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM Programmability OTPROM OTPROM
Seated Height-Max 5.08 mm 5.84 mm
Speed 2.1 MHz 2.1 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology HCMOS HCMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code No
CPU Family 6805
JESD-609 Code e0
On Chip Program ROM Width 8
Package Equivalence Code DIP28,.6
RAM (bytes) 176
ROM (words) 4672
Supply Current-Max 7 mA
Terminal Finish TIN LEAD

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