MC74HC132AND
vs
74HC132N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
DIP, DIP14,.3
SOT-27-1, DIP-14
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
0.004 A
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
31 ns
31 ns
Schmitt Trigger
YES
YES
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Pbfree Code
Part Package Code
DIP
Pin Count
14
ECCN Code
EAR99
HTS Code
8542.39.00.01
Family
HC/UH
Length
19.025 mm
Number of Functions
4
Number of Inputs
2
Packing Method
BULK
Propagation Delay (tpd)
38 ns
Qualification Status
Not Qualified
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Width
7.62 mm
Compare 74HC132N with alternatives