MC912DG128ACPV vs MC912DG128AVPVE feature comparison

MC912DG128ACPV Rochester Electronics LLC

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MC912DG128AVPVE NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description TQFP-112 TQFP-112
Pin Count 112
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width 16 16
Bit Size 16 16
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G112 S-PQFP-G112
Length 20 mm 20 mm
Number of I/O Lines 85 83
Number of Terminals 112 112
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS HCMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Boundary Scan NO
JESD-609 Code e3
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Qualification Status Not Qualified
ROM (words) 131072
Terminal Finish Tin (Sn)

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Compare MC912DG128AVPVE with alternatives