MC9328MXLDVP15R2 vs WED3C7410E16M-400BM feature comparison

MC9328MXLDVP15R2 Freescale Semiconductor

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WED3C7410E16M-400BM Microsemi Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MICROSEMI CORP-PMG MICROELECTRONICS
Part Package Code BGA BGA
Package Description 13 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-225 21 X 25 MM, CERAMIC, BGA-225
Pin Count 225 225
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 25 32
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 16 MHz 133 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B225 R-CBGA-B225
Length 13 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 225 225
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -30 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LFBGA BGA
Package Equivalence Code BGA225,15X15,32
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Speed 150 MHz 400 MHz
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER MILITARY
Terminal Finish TIN SILVER COPPER OVER NICKEL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2

Compare MC9328MXLDVP15R2 with alternatives

Compare WED3C7410E16M-400BM with alternatives