MC9328MXLVF20
vs
WED3C7410E16M-400BM
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MICROSEMI CORP-PMG MICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA, BGA225,15X15,32
|
21 X 25 MM, CERAMIC, BGA-225
|
| Pin Count |
225
|
225
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
25
|
32
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
16 MHz
|
133 MHz
|
| External Data Bus Width |
32
|
64
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B225
|
R-CBGA-B225
|
| Length |
13 mm
|
|
| Low Power Mode |
YES
|
NO
|
| Number of Terminals |
225
|
225
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
LFBGA
|
BGA
|
| Package Equivalence Code |
BGA225,15X15,32
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
200 MHz
|
400 MHz
|
| Supply Voltage-Max |
2 V
|
1.9 V
|
| Supply Voltage-Min |
1.8 V
|
1.7 V
|
| Supply Voltage-Nom |
1.9 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MC9328MXLVF20 with alternatives
Compare WED3C7410E16M-400BM with alternatives