MC9S08GB60ACFUER vs MC9S08GB60ACFUE feature comparison

MC9S08GB60ACFUER NXP Semiconductors

Buy Now Datasheet

MC9S08GB60ACFUE NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64 10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 57 Weeks, 4 Days
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Additional Feature OPERATES AT 1.8V MINIMUM SUPPLY OPERATES AT 1.8V MINIMUM SUPPLY
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e3
Length 10 mm 10 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 56 56
Number of Terminals 64 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.08 V 2.08 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 2

Compare MC9S08GB60ACFUER with alternatives

Compare MC9S08GB60ACFUE with alternatives