MC9S08GT60ACFBE vs MC9S08GT60ACFBER feature comparison

MC9S08GT60ACFBE NXP Semiconductors

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MC9S08GT60ACFBER NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 10 X 10 MM, 2 MM HEIGHT, 0.8 MM PITCH, QFP-44 10 X 10 MM, 2 MM HEIGHT, 0.8 MM PITCH, QFP-44
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Additional Feature OPERATES AT 1.8V MINIMUM SUPPLY OPERATES AT 1.8V MINIMUM SUPPLY
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G44 S-PQFP-G44
JESD-609 Code e3 e3
Length 10 mm 10 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 36 36
Number of Terminals 44 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.45 mm 2.45 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.08 V 2.08 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1

Compare MC9S08GT60ACFBE with alternatives

Compare MC9S08GT60ACFBER with alternatives