MC9S08QE8CLC vs MC9S08QE8CWL feature comparison

MC9S08QE8CLC NXP Semiconductors

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MC9S08QE8CWL NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32 ROHS COMPLIANT, MS-013AE, SOIC-28
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G32 R-PDSO-G28
JESD-609 Code e3 e3
Length 7 mm 17.95 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 28 24
Number of Terminals 32 28
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP SOP
Package Equivalence Code QFP32,.35SQ,32 SOP28,.4
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 512
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 1.4 mm 2.65 mm
Speed 20 MHz 20 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.8 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 7 mm 7.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1

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