MC9S08QE8CTG vs MC9S08QE8CPG feature comparison

MC9S08QE8CTG NXP Semiconductors

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MC9S08QE8CPG Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 0.65 MM PITCH, ROHS COMPLIANT, TSSOP-16 ROHS COMPLIANT, PLASTIC, DIP-16
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e3 e3
Length 5 mm 19.175 mm
Moisture Sensitivity Level 3
Number of I/O Lines 14 14
Number of Terminals 16 16
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 512
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm 4.44 mm
Speed 20 MHz 20 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 1.8 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 4.4 mm 7.62 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 16

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