MC9S08SH8CPJ vs MC9S08SH8CSC feature comparison

MC9S08SH8CPJ NXP Semiconductors

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MC9S08SH8CSC NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description PLASTIC, DIP-20 SOP, SOP8,.25
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T20 R-PDSO-G8
JESD-609 Code e3 e3
Length 24.69 mm 4.9 mm
Number of I/O Lines 17 17
Number of Terminals 20 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP20,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 512
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 5.08 mm 1.75 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 7.62 mm 3.9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Factory Lead Time 4 Weeks
Moisture Sensitivity Level 3

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Compare MC9S08SH8CSC with alternatives