MC9S08SH8CTGR vs MB95F222KPF-G-SNE1 feature comparison

MC9S08SH8CTGR NXP Semiconductors

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MB95F222KPF-G-SNE1 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS SPANSION INC
Package Description 0.65 MM PITCH, TSSOP-20 SOP,
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 5 MHz 32.5 MHz
DAC Channels YES NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e3
Length 5 mm 10.15 mm
Moisture Sensitivity Level 3
Number of I/O Lines 14 13
Number of Terminals 16 16
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 512
ROM (words) 8192 4096
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm 2.25 mm
Speed 40 MHz 16.25 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 4.4 mm 5.3 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 4

Compare MC9S08SH8CTGR with alternatives

Compare MB95F222KPF-G-SNE1 with alternatives