MC9S08SH8MSC vs MC9S08SH8MTJ feature comparison

MC9S08SH8MSC NXP Semiconductors

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MC9S08SH8MTJ Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description MS-012AA, SOIC-8 0.65 MM PITCH, TSSOP-20
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 5 MHz
DAC Channels NO YES
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G8 R-PDSO-G20
JESD-609 Code e3 e3
Length 4.9 mm 6.5 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 6 17
Number of Terminals 8 20
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
RAM (bytes) 512
ROM (words) 8192
ROM Programmability FLASH FLASH
Seated Height-Max 1.75 mm 1.2 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 2.7 V
Supply Voltage-Nom 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 3.9 mm 4.4 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 3
Pbfree Code Yes
Part Package Code TSSOP
Pin Count 20

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