MC9S08SH8MTJ vs MC9S08SH8MFKR feature comparison

MC9S08SH8MTJ Rochester Electronics LLC

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MC9S08SH8MFKR NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description 0.65 MM PITCH, TSSOP-20 4 X 4 MM, 1 MM HEIGHT, MO-220VGGD-6, QFN-24
Pin Count 20
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 5 MHz 38.4 MHz
DAC Channels YES NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G20 S-PQCC-N24
JESD-609 Code e3
Length 6.5 mm 4 mm
Moisture Sensitivity Level 3
Number of I/O Lines 17 18
Number of Terminals 20 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 2.7 V
Supply Voltage-Nom 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 4.4 mm 4 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 2
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Boundary Scan NO
On Chip Program ROM Width 8
Package Equivalence Code LCC24,.16SQ,20
Qualification Status Not Qualified
RAM (bytes) 512
ROM (words) 8192
Supply Current-Max 7.7 mA

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