MCF52230CAL60
vs
MCF52231CAF60
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
20 X 20 MM. 1.40 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, MS-026BFA, LQFP-112
|
14 X 14 MM, ROHS COMPLIANT, PLASTIC, LQFP-80
|
| Pin Count |
112
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 3V SUPPLY
|
ALSO OPERATES AT 3V SUPPLY
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| CPU Family |
COLDFIRE
|
COLDFIRE
|
| Clock Frequency-Max |
60 MHz
|
60 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G112
|
S-PQFP-G80
|
| JESD-609 Code |
e3
|
e3
|
| Length |
20 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
73
|
73
|
| Number of Terminals |
112
|
80
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LQFP
|
| Package Equivalence Code |
QFP112,.87SQ
|
QFP80,.64SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
32768
|
32768
|
| ROM (words) |
131072
|
131072
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Speed |
60 MHz
|
60 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3.3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
20 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
13 Weeks
|
|
|
|
Compare MCF52230CAL60 with alternatives
Compare MCF52231CAF60 with alternatives