MCF5251EVM140 vs WED3C7410E16M-400BM feature comparison

MCF5251EVM140 Freescale Semiconductor

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WED3C7410E16M-400BM Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MICROSEMI CORP-PMG MICROELECTRONICS
Part Package Code BGA BGA
Package Description LEAD FREE, MAPBGA-225 21 X 25 MM, CERAMIC, BGA-225
Pin Count 225 225
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 24 32
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 140 MHz 133 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B225 R-CBGA-B225
Length 13 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3
Number of Terminals 225 225
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LFBGA BGA
Package Equivalence Code BGA225,15X15,32
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Speed 140 MHz 400 MHz
Supply Voltage-Max 1.32 V 1.9 V
Supply Voltage-Min 1.08 V 1.7 V
Supply Voltage-Nom 1.2 V 1.8 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN SILVER COPPER OVER NICKEL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 13 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 2
Pbfree Code No

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Compare WED3C7410E16M-400BM with alternatives