MCF5272CVM66 vs MC68SZ328VH66V feature comparison

MCF5272CVM66 NXP Semiconductors

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MC68SZ328VH66V Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description PLASTIC, BGA-196 LFBGA, BGA196,14X14,32
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Address Bus Width 23 25
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 66 MHz 16 MHz
External Data Bus Width 32 16
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e1 e0
Length 15 mm 12 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 196 196
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.36 mm
Speed 66 MHz 66 MHz
Supply Voltage-Max 3.6 V 3.3 V
Supply Voltage-Min 3 V 2.7 V
Supply Voltage-Nom 3.3 V 3 V
Surface Mount YES YES
Technology CMOS HCMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 15 mm 12 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 196
Package Equivalence Code BGA196,14X14,32
Supply Current-Max 80 mA

Compare MCF5272CVM66 with alternatives

Compare MC68SZ328VH66V with alternatives