MCIMX6S5DVM10ABR
vs
MCIMX6S5EVM10AC
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
MABGA-624
|
MABGA-624
|
Reach Compliance Code |
unknown
|
compliant
|
JESD-30 Code |
S-PBGA-B624
|
S-PBGA-B624
|
JESD-609 Code |
e1
|
e1
|
Length |
21 mm
|
21 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
624
|
624
|
Operating Temperature-Max |
95 °C
|
105 °C
|
Operating Temperature-Min |
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA624,25X25,32
|
BGA624,25X25,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Max |
1.5 V
|
1.5 V
|
Supply Voltage-Min |
1.35 V
|
1.35 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
21 mm
|
21 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
5A992
|
HTS Code |
|
8542.31.00.01
|
Samacsys Manufacturer |
|
NXP
|
|
|
|