MCM69R737AZP8R
vs
MCM63F737KZP8.5
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Package Description |
14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
|
BGA,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
3.5 ns
|
8.5 ns
|
Additional Feature |
BYTE WRITE CONTROL; BOUNDARY SCAN
|
FLOW-THROUGH ARCHITECTURE
|
JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B119
|
Length |
22 mm
|
22 mm
|
Memory Density |
4718592 bit
|
4718592 bit
|
Memory IC Type |
LATE-WRITE SRAM
|
CACHE SRAM
|
Memory Width |
36
|
36
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
119
|
119
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
128KX36
|
128KX36
|
Output Characteristics |
3-STATE
|
|
Output Enable |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.4 mm
|
2.4 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3.15 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
4
|
4
|
|
|
|
Compare MCM69R737AZP8R with alternatives
Compare MCM63F737KZP8.5 with alternatives