MCP2562T-E/MF
vs
MCP2562FDT-E/SN
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Package Description |
Hvson, Solcc8,.12,25
|
Sop, Sop8,.25
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
DFN-8
|
SOIC-8
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
6 Weeks
|
| Data Rate |
1000 Mbps
|
8000 Mbps
|
| JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 Mm
|
4.9 Mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
HVSON
|
SOP
|
| Package Equivalence Code |
SOLCC8,.12,25
|
SOP8,.25
|
| Package Shape |
Square
|
Rectangular
|
| Package Style |
Small Outline, Heat Sink/Slug, Very Thin Profile
|
Small Outline
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
Ts 16949
|
Ts 16949
|
| Seated Height-Max |
1 Mm
|
1.75 Mm
|
| Supply Current-Max |
70 Ma
|
70 Ma
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
Yes
|
Yes
|
| Telecom IC Type |
Can Transceiver
|
Can Fd Transceiver
|
| Temperature Grade |
Automotive
|
Automotive
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
No Lead
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
1.27 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Width |
3 Mm
|
3.9 Mm
|
| Base Number Matches |
1
|
1
|
|
|
|