MCP33111-10-E/MN
vs
MCP33111-10T-E/MN
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVSON, SOLCC10,.12,20
|
HVSON, SOLCC10,.12,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
9 Weeks
|
9 Weeks
|
| Date Of Intro |
2018-11-28
|
2018-11-28
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog Input Voltage-Max |
5 V
|
5 V
|
| Analog Input Voltage-Min |
-5 V
|
-5 V
|
| Conversion Time-Max |
0.75 µs
|
0.75 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
S-PDSO-N10
|
S-PDSO-N10
|
| Length |
3 mm
|
3 mm
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
OFFSET BINARY
|
OFFSET BINARY
|
| Output Format |
SERIAL
|
SERIAL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC10,.12,20
|
SOLCC10,.12,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Sample Rate |
1 MHz
|
1 MHz
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Screening Level |
AEC-Q100; TS 16949
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max |
2.4 mA
|
2.4 mA
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP33111-10-E/MN with alternatives
Compare MCP33111-10T-E/MN with alternatives