MCP33111D-10-E/MS
vs
MCP33111D-10T-I/MN
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP,
|
HVSON,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
13 Weeks
|
|
| Date Of Intro |
2018-11-14
|
2018-03-09
|
| Samacsys Manufacturer |
Microchip
|
|
| Analog Input Voltage-Max |
5.1 V
|
5.1 V
|
| Analog Input Voltage-Min |
-5.1 V
|
-5.1 V
|
| Conversion Time-Max |
0.75 µs
|
0.75 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, FLASH/SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
S-PDSO-G10
|
S-PDSO-N10
|
| Length |
3 mm
|
3 mm
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
2'S COMPLEMENT BINARY
|
2'S COMPLEMENT BINARY
|
| Output Format |
SERIAL
|
SERIAL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVSON
|
| Package Equivalence Code |
TSSOP10,.19,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Sample Rate |
1 MHz
|
1 MHz
|
| Screening Level |
AEC-Q100; TS 16949
|
|
| Seated Height-Max |
1.1 mm
|
0.8 mm
|
| Supply Current-Max |
2.4 mA
|
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Linearity Error-Max (EL) |
|
0.0003%
|
|
|
|
Compare MCP33111D-10-E/MS with alternatives
Compare MCP33111D-10T-I/MN with alternatives