MCP37231-200E/TE
vs
MCP37231-200E/TL
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TFBGA, BGA121,11X11,25
|
HVBCC, LGA124,18X18,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.5.A.5
|
3A991.C.4
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
|
| Date Of Intro |
2019-12-10
|
2019-12-10
|
| Analog Input Voltage-Max |
4.46 V
|
1.26 V
|
| Analog Input Voltage-Min |
-4.46 V
|
1.14 V
|
| Conversion Time-Max |
0.025 µs
|
0.025 µs
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
| JESD-30 Code |
S-PBGA-B121
|
S-XBCC-B124
|
| Length |
8 mm
|
9 mm
|
| Number of Analog In Channels |
8
|
8
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
121
|
124
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TFBGA
|
HVBCC
|
| Package Equivalence Code |
BGA121,11X11,25
|
LGA124,18X18,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Sample Rate |
200 MHz
|
200 MHz
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.08 mm
|
0.95 mm
|
| Supply Current-Max |
300 mA
|
232 mA
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
BALL
|
BUTT
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
8 mm
|
9 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP37231-200E/TE with alternatives
Compare MCP37231-200E/TL with alternatives