MCP4725A0T-E/CHVAO
vs
AD5321BRTZ-REEL7
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ANALOG DEVICES INC
|
| Package Description |
LSSOP,
|
ROHS COMPLIANT, MO-178AB, SOT-23, 6 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
Analog Devices
|
| Analog Output Voltage-Max |
5.5 V
|
5.499 V
|
| Analog Output Voltage-Min |
|
0.001 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
e4
|
| Length |
2.9 mm
|
2.9 mm
|
| Linearity Error-Max (EL) |
0.354%
|
0.3906%
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
LSSOP
|
| Package Equivalence Code |
TSOP6,.11,37
|
TSOP6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.45 mm
|
1.45 mm
|
| Settling Time-Nom (tstl) |
6 µs
|
8 µs
|
| Supply Current-Max |
0.4 mA
|
0.225 mA
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.55 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
6
|
| Manufacturer Package Code |
|
RJ-6
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Settling Time-Max |
|
10 µs
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MCP4725A0T-E/CHVAO with alternatives
Compare AD5321BRTZ-REEL7 with alternatives